Interlink Electronics (LINK: OTC Pink Current) | Interlink Electronics, Inc. Announces the Hiring of a VP of Operations Based in Shenzhen, China and the Departure of Howard D. Goldberg, Ph.D.

Interlink Electronics, Inc. Announces the Hiring of a VP of Operations Based in Shenzhen, China and the Departure of Howard D. Goldberg, Ph.D.

Sep 17, 2014

OTC Disclosure News Service

Interlink Electronics, Inc. (OTC: LINK), is a global leader in sensor
and human-machine interface technologies (“Interlink”). Interlink
continues to make progress in its transition from an FSR (Force Sensor
Resistor) company to a HMI (Human Machine Interface) company. In light
of our growth in the Asia Pacific Region, as evidenced by the continued
expansion of our manufacturing facility in Shenzhen, China through the
hiring additional employees and the launch of Interlink’s Global RD
center in Singapore, Interlink’s Board of Directors has determined that
it is important to hire an experienced operations manager, based in
Shenzhen, to oversee and work closely with our Shenzhen manufacturing
team. We are pleased to announce that John Sirbu, an operations veteran,
has agreed to join of the Interlink team as Interim VP Operations, based
in Shenzhen, China, starting on October 13, 2014. Mr. Sirbu brings with
him over 20 years in executive leadership and manufacturing experience
with leading Japanese, European and American companies.

“Interlink’s growth in APAC region and the expansion of our
manufacturing efforts in Shenzhen, China, require local executive
leadership. I believe that Mr. Sirbu’s extensive experience will greatly
benefit the operations of Interlink’s Shenzhen manufacturing facility as
well as the growth of our business in the APAC region,” stated Steven N.
Bronson, Interlink’s Chairman and CEO.

Based on Interlink’s current and future expansion of operations in the
APAC Region, it has been determined that Howard D. Goldberg, Ph.D. will
be leaving Interlink effective September 30, 2014. Steven N. Bronson,
our Chairman and CEO shall assume the title and responsibilities of
President of Interlink effective October 1, 2014.

“We truly wish Howard all the best with his future endeavors and are
grateful to him for his contributions to Interlink during his tenure,”
stated Mr. Bronson. “I believe strongly in Interlink’s future and look
forward to working closely with the Interlink team and to drive our
business to the next level,” continued Mr. Bronson.

About Interlink Electronics, Inc.

Interlink Electronics is a world-leading trusted advisor and technology
partner in the advancing world of human-machine interface and sensor
technologies. Interlink Electronics has led the printed electronics
industry in its commercialization of its patented Force-Sensing Resistor
(FSR®) technology, which has enabled rugged and reliable human-machine
interface (“HMI”) solutions. For over 29 years, Interlink Electronics’
solutions have focused on handheld user input, menu navigation, cursor
control, and other intuitive interface technologies for the world’s top
electronics manufacturers. Interlink Electronics has a proven track
record of supplying human-machine interface solutions for
mission-critical applications in a wide range of markets, including, but
not limited to, consumer electronics, automotive, industrial, and
medical devices. Interlink Electronics serves a world-class
customer-base from its corporate headquarters in Camarillo, California
(greater Los Angeles area), manufacturing facility in Shenzhen, China,
distribution and warehouse facility in Hong Kong, global RD office in
Singapore, global sales office in the United Kingdom, and sales office
in Japan. For more information, please see our website at: http://www.interlinkelectronics.com.

FORWARD LOOKING STATEMENTS: This release contains “forward-looking
statements” involving a number of risks and uncertainties as defined in
the Private Securities Litigation Reform Act of 1995. The following are
among the factors that could cause actual results to differ materially
from the forward-looking statements: historical losses and negative cash
flow, the success of business divestitures and acquisitions, the
ownership of the majority of our stock by a small group of investors,
our success in predicting new markets and the acceptance of our new
products, efficient management of our infrastructure, the pace of
technological developments and industry standards evolution and their
effect on our target product and market choices, the effect of
outsourcing technology development, changes in the ordering patterns of
our customers, a decrease in the quality and/or reliability of our
products, protection of our proprietary intellectual property,
competition by alternative sophisticated as well as generic products,
pending litigation against Interlink Electronics, historical weaknesses
in internal controls over financial reporting, continued availability of
raw materials for our products at competitive prices, disruptions in our
manufacturing facilities, risks of international sales and operations
including fluctuations in exchange rates, compliance with regulatory
requirements applicable to our manufacturing operations, and customer
concentrations. The forward-looking statements contained in this release
should be considered in light of these risk factors.

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The above news release has been provided by the above company via the OTC Disclosure and News Service. Issuers of news releases and not OTC Markets Group Inc. are solely responsible for the accuracy of such news releases.

Article source: http://www.otcmarkets.com/stock/LINK/news?id=88086

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